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Secure a Quote on Boyd (Formerly Aavid) Part Number 342000F00000G, a Heat Sinks Product

Mfg Part Number : 342000F00000G
Manufacturer : Boyd (Formerly Aavid)
Main Category : Thermal Management
Category : Heat Sinks
Sub Category : Fpga And Bga Heat Sinks
Description : Boyd 342000f00000g - 101.6mm Length, 25.4mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications.

Should you wish to secure pricing details on Boyd (Formerly Aavid) part number 342000F00000G, a Boyd 342000f00000g - 101.6mm Length, 25.4mm Width - Low Profile Copper Heat Sink For Pci And Agp Chip Sets When Space Is At A Premium, Boyd???S Thin-Fin Heat Sinks Reduce Package Case Temperature By As Much As 20??C. These Flexible, Copper Spreaders Attach To The Electronic Package Using Pre-Applied Adhesive, Providing An Off-Theshelf Solution For Pci And Agp Chip Sets. A Laminated Dielectric Coating Prevents Shorting,Making The Thin-Fin Ideal For Bga Devices And Multimedia Applications. item featured within the product category Heat Sinks, you are in the right place. Here, you can use the Request for Quote (RFQ) form below to offer our team various information concerning this electromechanical part, such as your anticipated fulfillment date, target price, and desired quantity. Once we receive and assess your submission, one of our experts will get in touch with you to provide a customized response for your consideration.

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Disclaimer: This is a quotation for the goods listed above. This quotation is meant as an estimate and does not reflect a final bill or invoice. All quotations are subject to change until acceptance by ASAP Semiconductor of a binding Purchase Order, and quotations may be withdrawn or revised at the sole discretion of ASAP Semiconductor. This quotation is subject to the ASAP Semiconductor Terms & Conditions available at https://www.asapsemi.com/customer-terms-conditions.aspx .All United States Government and Department of Defense bids are quoted as CAGE code 6RE77 from ASAP Semiconductor’s Anaheim, California facility. Any quotation from ASAP Semiconductor without 6RE77 is void.

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Product Characteristics of 342000F00000G

Attachment Method -
Base Product Number 342000
Category Fans, Thermal Management, Thermal, Heat Sinks
Diameter -
Fin Height -
Material Finish -
Mfr Aavid, Thermal Division of Boyd Corporation
Package Cooled -
Power Dissipation @ Temperature Rise -
Product Status Active
Shape -
Thermal Resistance @ Forced Air Flow -
Thermal Resistance @ Natural -
Type -

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Part 342000F00000G With Different Manufacturers

342000F00000G
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